View LPC2364FB100_519684.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

LPC2364/66/68
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Rev. 01 -- 22 September 2006 Preliminary data sheet
1. General description
The LPC2364/66/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical performance in interrupt service routines and DSP algorithms, this increases performance up to 30 % over Thumb mode. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. The LPC2364/66/68 are ideal for multi-purpose serial communication applications. They incorporate a 10/100 Ethernet Media Access Controller (MAC), USB full speed device with 4 kB Endpoint RAM, four UARTs, two CAN channels, an SPI interface, two Synchronous Serial Ports (SSP), three I2C interfaces, and an I2S interface. This blend of serial communications interfaces combined with an on-chip 4 MHz internal oscillator, SRAM of up to 32 kB, 16 kB SRAM for Ethernet, 8 kB SRAM for USB and general purpose use, together with 2 kB battery powered SRAM make these devices very well suited for communication gateways and protocol converters. Various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, one PWM unit, a CAN control unit, and up to 70 fast GPIO lines with up to 12 edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.
2. Features
ARM7TDMI-S processor, running at up to 72 MHz. Up to 512 kB on-chip Flash Program Memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. Flash program memory is on the ARM local bus for high performance CPU access. 8/32 kB of SRAM on the ARM local bus for high performance CPU access. 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM. 8 kB SRAM for general purpose DMA use also accessible by the USB. Dual AHB system that provides for simultaneous Ethernet DMA, USB DMA, and program execution from on-chip Flash with no contention between those functions. A bus bridge allows the Ethernet DMA to access the other AHB subsystem. Advanced Vectored Interrupt Controller, supporting up to 32 vectored interrupts. General Purpose AHB DMA controller (GPDMA) that can be used with the SSP serial interfaces, the I2S port, and the SD/MMC card port, as well as for memory-to-memory transfers. Serial Interfaces:
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Ethernet MAC with associated DMA controller. These functions reside on an independent AHB bus. USB 2.0 Full-Speed Device with on-chip PHY and associated DMA controller. Four UARTs with fractional baud rate generation, one with modem control I/O, one with IrDA support, all with FIFO. CAN controller with two channels. SPI controller. Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate for the SPI port, sharing its interrupt and pins. These can be used with the GPDMA controller. Three I2C-bus interfaces (one with open-drain and two with standard port pins). I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with the GPDMA. Other Peripherals: Secure Digital (SD) / MultiMediaCard (MMC) memory card interface (LPC2368 only). 70 General purpose I/O pins with configurable pull-up/down resistors. 10-bit ADC with input multiplexing among 6 pins. 10-bit DAC. Four general purpose Timers/Counters with total of 8 capture inputs and 10 compare outputs. Each Timer block has an external count input. One PWM / Timer block with support for three-phase motor control. The PWM has two external count inputs. Real Time Clock with separate power pin, clock source can be the RTC oscillator or the APB clock. 2 kB SRAM powered from the RTC power pin, allowing data to be stored when the rest of the chip is powered off. Watchdog Timer. The watchdog timer can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock. Standard ARM Test/Debug interface for compatibility with existing tools. Emulation Trace Module supports real-time trace. Single 3.3 V power supply (3.0 V to 3.6 V). Four reduced power modes, Idle, Sleep, Power Down, and Deep Power down. Four external interrupt inputs configurable as edge/level sensitive. All pins on PORT0 and PORT2 can be used as edge sensitive interrupt sources. Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt). Two independent power domains allow fine tuning of power consumption based on needed features. Each peripheral has its own clock divider for further power saving. Brownout detect with separate thresholds for interrupt and forced reset. On-chip Power On Reset. On-chip crystal oscillator with an operating range of 1 MHz to 24 MHz. 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as the system clock. When used as the CPU clock, does not allow CAN and USB to run.
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
2 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
On-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the RTC oscillator. Versatile pin function selections allow more possibilities for using on-chip peripheral functions.
3. Applications
Industrial control Medical systems Protocol converter Communications
4. Ordering information
Table 1. Ordering information Package Name LPC2364FBD100 LPC2366FBD100 LPC2368FBD100 LQFP100 Description plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm Version SOT407-1 Type number
4.1 Ordering options
Table 2. Ordering options Flash SRAM (kB) Ethernet USB CAN SD/ GP ADC DAC Temp (kB) Local Ether. GP/ RTC Total dev + MMC DMA range 4 kB bus buff USB FIFO 8 32 32 16 16 16 8 8 8 2 2 2 34 58 58 RMII RMII RMII yes yes yes 2 ch no 2 ch no 2 ch yes yes yes yes 6 ch 1 ch -40 C to +85 C LPC2366FB100 256 LPC2368FB100 512 6 ch 1 ch -40 C to +85 C 6 ch 1 ch -40 C to +85 C Type number
LPC2364FB100 128
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
3 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
5. Block diagram
X2 X1 VDDA RESET VDD(3V3) VREF VSSA, VSS
TMS TDI
trace signals
TRST TCK TDO EXTIN0
LPC2364/66/68
P0, P1, P2, P3, P4 HIGH SPEED GP I/O 70 PINS TOTAL 8/32 kB SRAM
TEST/DEBUG INTERFACE
EMULATION TRACE MODULE
128/256/ 512 kB FLASH
PLL system clock
SYSTEM FUNCTIONS INTERNAL RC OSCILLATOR
INTERNAL CONTROLLERS SRAM FLASH
ARM7TDMI-S
VECTORED INTERRUPT CONTROLLER AHB BRIDGE 8 kB SRAM AHB1
AHB2
AHB BRIDGE
RMII(8)
ETHERNET MAC WITH DMA
16 kB SRAM
MASTER AHB TO SLAVE PORT APB BRIDGE PORT AHB TO APB BRIDGE
USB WITH 4 kB RAM & DMA
VBUS U1D+, U1D- U1CONNECT U1UP_LED
GP DMA CONTROLLER I2SRX_CLK I2STX_CLK I2SRX_WS I2STX_WS I2SRX_SDA I2STX_SDA SCK, SCK0 MOSI, MOSI0 MISO, MISO0 SSEL, SSEL1 SCK1 MOSI1 MIS01 SSEL1 MCICLK, MCIPWR MCICMD, MCIDAT[3:0] TXD0, TXD2, TXD3 RXD0, RXD2, RXD3 TXD1 RXD1 DTR1, RTS1 DSR1, CTS1, DCD1, RI1 CAN1, CAN2 I2C0, I2C1, I2C2 RD1, RD2 TD1, TD2 SCL0, SCL1, SCL2 SDA0, SDA1, SDA2
EINT3 to EINT0 P0, P2 2 x CAP0, 1, 2, 3 4 x MAT2, 2 x MAT0, 1, 3 6 x PWM1 2 x PCAP1
EXTERNAL INTERRUPTS CAPTURE/COMPARE TIMER0/TIMER1/ TIMER2/TIMER3 I2S INTERFACE
PWM1
SPI, SSP0 INTERFACE
P0, P1
LEGAC Y GP I/O 52 PINS TOTAL
SSP1 INTERFACE
AD0[5:0]
A/D CONVERTER
SD/MMC CARD INTERFACE(1)
AOUT
D/A CONVERTER UART0, UART2, UART3
VBAT power domain 2 RTCX1 RTCX2
2 kB BATTERY RAM
RTC OSCILLATOR
REAL TIME CLOCK
UART1
WATCHDOG TIMER SYSTEM CONTROL
002aac566
(1) LPC2368 only.
Fig 1. LPC2364/66/68 block diagram
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
4 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
6. Pinning information
6.1 Pinning
100 76 75 51 26 50
002aac576
1
LPC2364FBD100 LPC2366FBD100 LPC2368FBD100
25
Fig 2. LPC2364/66/68 pinning
6.2 Pin description
Table 3. Symbol P0.0 to P0.31 Pin description Pin Type location I/O Description Port 0: Port 0 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the Pin Connect block. Pins 12, 13, 14, and 31 of this port are not available. P0.0 -- General purpose digital input/output pin. RD1 -- CAN1 receiver input. TXD3 -- Transmitter output for UART3. SDA1 -- I2C1 data input/output (this is not an open drain pin). P0.1 -- General purpose digital input/output pin. TD1 -- CAN1 transmitter output. RXD3 -- Receiver input for UART3. SCL1 -- I2C1 clock input/output (this is not an open drain pin). P0.2 -- General purpose digital input/output pin. TXD0 -- Transmitter output for UART0. P0.3 -- General purpose digital input/output pin. RXD0 -- Receiver input for UART0. P0.4 -- General purpose digital input/output pin. I2SRX_CLK -- Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. RD2 -- CAN2 receiver input. CAP2.0 -- Capture input for Timer 2, channel 0.
P0.0/RD1/ TXD3/SDA1
46
I/O I O I/O
P0.1/TD1/ RXD3/SCL1
47
I/O O I I/O
P0.2/TXD0 P0.3/RXD0 P0.4/ I2SRX_CLK/ RD2/CAP2.0
98 99 81
I/O O I/O I I/O I/O I I
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
5 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol
Pin description ...continued Pin Type location 80 I/O I/O O I Description P0.5 -- General purpose digital input/output pin. I2SRX_WS -- Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. TD2 -- CAN2 transmitter output. CAP2.1 -- Capture input for Timer 2, channel 1. P0.6 -- General purpose digital input/output pin. I2SRX_SDA -- Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. SSEL1 -- Slave Select for SSP1. MAT2.0 -- Match output for Timer 2, channel 0. P0.7 -- General purpose digital input/output pin. I2STX_CLK -- Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. SCK1 -- Serial Clock for SSP1. MAT2.1 -- Match output for Timer 2, channel 1. P0.8 -- General purpose digital input/output pin. I2STX_WS -- Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. MISO1 -- Master In Slave Out for SSP1. MAT2.2 -- Match output for Timer 2, channel 2. P0.9 -- General purpose digital input/output pin. I2STX_SDA -- Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. MOSI1 -- Master Out Slave In for SSP1. MAT2.3 -- Match output for Timer 2, channel 3. P0.10 -- General purpose digital input/output pin. TXD2 -- Transmitter output for UART2. SDA2 -- I2C2 data input/output (this is not an open drain pin). MAT3.0 -- Match output for Timer 3, channel 0. P0.11 -- General purpose digital input/output pin. RXD2 -- Receiver input for UART2. SCL2 -- I2C2 clock input/output (this is not an open drain pin). MAT3.1 -- Match output for Timer 3, channel 1. P0.15 -- General purpose digital input/output pin. TXD1 -- Transmitter output for UART1. SCK0 -- Serial clock for SSP0. SCK -- Serial clock for SPI. P0.16 -- General purpose digital input/output pin. RXD1 -- Receiver input for UART1. SSEL0 -- Slave Select for SSP0. SSEL -- Slave Select for SPI.
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
P0.5/ I2SRX_WS/ TD2/CAP2.1
P0.6/ I2SRX_SDA/ SSEL1/MAT2.0
79
I/O I/O I/O O
P0.7/ I2STX_CLK/ SCK1/MAT2.1
78
I/O I/O I/O O
P0.8/ I2STX_WS/ MISO1/MAT2.2
77
I/O I/O I/O O
P0.9/ I2STX_SDA/ MOSI1/MAT2.3
76
I/O I/O I/O O
P0.10/TXD2/ SDA2/MAT3.0
48
I/O O I/O O
P0.11/RXD2/ SCL2/MAT3.1
49
I/O I I/O O
P0.15/TXD1/ SCK0/SCK
62
I/O O I/O I/O
P0.16/RXD1/ SSEL0/SSEL
63
I/O I I/O I/O
LPC2364_66_68_1
Preliminary data sheet
Rev. 01 -- 22 September 2006
6 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol
Pin description ...continued Pin Type location 61 I/O I I/O I/O Description P0.17 -- General purpose digital input/output pin. CTS1 -- Clear to Send input for UART1. MISO0 -- Master In Slave Out for SSP0. MISO -- Master In Slave Out for SPI. P0.18 -- General purpose digital input/output pin. DCD1 -- Data Carrier Detect input for UART1. MOSI0 -- Master Out Slave In for SSP0. MOSI -- Master Out Slave In for SPI. P0.19 -- General purpose digital input/output pin. DSR1 -- Data Set Ready input for UART1. MCICLK -- Clock output line for SD/MMC interface. (LPC2368 only) SDA1 -- I2C1 data input/output (this is not an open drain pin). P0.20 -- General purpose digital input/output pin. DTR1 -- Data Terminal Ready output for UART1. MCICMD -- Command line for SD/MMC interface. (LPC2368 only) SCL1 -- I2C1 clock input/output (this is not an open drain pin). P0.21 -- General purpose digital input/output pin. RI1 -- Ring Indicator input for UART1. MCIPWR -- Power Supply Enable for external SD/MMC power supply. (LPC2368 only) RD1 -- CAN1 receiver input. P0.22 -- General purpose digital input/output pin. RTS1 -- Request to Send output for UART1. MCIDAT0 -- Data line for SD/MMC interface. (LPC2368 only) TD1 -- CAN1 transmitter output. P0.23 -- General purpose digital input/output pin. AD0.0 -- ADC 0, input 0. I2SRX_CLK -- Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. CAP3.0 -- Capture input for Timer 3, channel 0. P0.24 -- General purpose digital input/output pin. AD0.1 -- ADC 0, input 1. I2SRX_WS -- Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. CAP3.1 -- Capture input for Timer 3, channel 1. P0.25 -- General purpose digital input/output pin. AD0.2 -- ADC 0, input 2. I2SRX_SDA -- Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. TXD3 -- Transmitter output for UART3.
P0.17/CTS1/ MISO0/MISO
P0.18/DCD1/ MOSI0/MOSI
60
I/O I I/O I/O
P0.19/DSR1/ MCICLK/SDA1
59
I/O I O I/O
P0.20/DTR1/ MCICMD/SCL1
58
I/O O I I/O
P0.21/RI1/ MCIPWR/RD1
57
I/O I O I
P0.22/RTS1/ MCIDAT0/TD1
56
I/O O O O
P0.23/AD0.0/ I2SRX_CLK/ CAP3.0
9
I/O I I/O I
P0.24/AD0.1/ I2SRX_WS/ CAP3.1
8
I/O I I/O I
P0.25/AD0.2/ I2SRX_SDA/ TXD3
7
I/O I I/O O
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
7 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol
Pin description ...continued Pin Type location 6 I/O I O I Description P0.26 -- General purpose digital input/output pin. AD0.3 -- ADC 0, input 3. AOUT -- DAC output. RXD3 -- Receiver input for UART3. P0.27 -- General purpose digital input/output pin. SDA0 -- I2C0 data input/output. Open drain output (for I2C compliance). P0.28 -- General purpose digital input/output pin. SCL0 -- I2C0 clock input/output. Open drain output (for I2C compliance). P0.29 -- General purpose digital input/output pin. U1D+ -- USB1 bidirectional D+ line. P0.30 -- General purpose digital input/output pin. U1D- -- USB1 bidirectional D- line. Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the Pin Connect block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not available. P1.0 -- General purpose digital input/output pin. ENET_TXD0 -- Ethernet transmit data 0. P1.1 -- General purpose digital input/output pin. ENET_TXD1 -- Ethernet transmit data 1. P1.4 -- General purpose digital input/output pin. ENET_TX_EN -- Ethernet transmit data enable. P1.8 -- General purpose digital input/output pin. ENET_CRS -- Ethernet carrier sense. P1.9 -- General purpose digital input/output pin. ENET_RXD0 -- Ethernet receive data. P1.10 -- General purpose digital input/output pin. ENET_RXD1 -- Ethernet receive data. P1.14 -- General purpose digital input/output pin. ENET_RX_ER -- Ethernet receive error. P1.15 -- General purpose digital input/output pin. ENET_REF_CLK -- Ethernet receiver clock. P1.16 -- General purpose digital input/output pin. ENET_MDC -- Ethernet MIIM clock. P1.17 -- General purpose digital input/output pin. ENET_MDIO -- Ethernet MI data input and output. P1.18 -- General purpose digital input/output pin. U1UP_LED -- USB1 GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. PWM1.1 -- Pulse Width Modulator 1, channel 1 output. CAP1.0 -- Capture input for Timer 1, channel 0.
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
P0.26/AD0.3/ AOUT/RXD3
P0.27/SDA0 P0.28/SCL0 P0.29/U1D+ P0.30/U1D- P1.0 to P1.31
25 24 29 30
I/O I/O I/O I/O I/O I/O I/O I/O I/O
P1.0/ ENET_TXD0 P1.1/ ENET_TXD1 P1.4/ ENET_TX_EN P1.8/ ENET_CRS P1.9/ ENET_RXD0 P1.10/ ENET_RXD1 P1.14/ ENET_RX_ER
95 94 93 92 91 90 89
I/O O I/O O I/O O I/O I I/O I I/O I I/O I I/O I I/O I I/O I/O I/O O
P1.15/ 88 ENET_REF_CL K P1.16/ ENET_MDC P1.17/ ENET_MDIO P1.18/ U1UP_LED/ PWM1.1/ CAP1.0 87 86 32
O I
LPC2364_66_68_1
Preliminary data sheet
Rev. 01 -- 22 September 2006
8 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol
Pin description ...continued Pin Type location 33 I/O I I/O O I/O I/O O I/O I/O O I/O O I/O I/O O I/O I/O O I/O O I I/O I I/O I O 45 I/O I O 21 I/O I I Description P1.19 -- General purpose digital input/output pin. CAP1.1 -- Capture input for Timer 1, channel 1. P1.20 -- General purpose digital input/output pin. PWM1.2 -- Pulse Width Modulator 1, channel 2 output. SCK0 -- Serial clock for SSP0. P1.21 -- General purpose digital input/output pin. PWM1.3 -- Pulse Width Modulator 1, channel 3 output. SSEL0 -- Slave Select for SSP0. P1.22 -- General purpose digital input/output pin. MAT1.0 -- Match output for Timer 1, channel 0. P1.23 -- General purpose digital input/output pin. PWM1.4 -- Pulse Width Modulator 1, channel 4 output. MISO0 -- Master In Slave Out for SSP0. P1.24 -- General purpose digital input/output pin. PWM1.5 -- Pulse Width Modulator 1, channel 5 output. MOSI0 -- Master Out Slave in for SSP0. P1.25 -- General purpose digital input/output pin. MAT1.1 -- Match output for Timer 1, channel 1. P1.26 -- General purpose digital input/output pin. PWM1.6 -- Pulse Width Modulator 1, channel 6 output. CAP0.0 -- Capture input for Timer 0, channel 0. P1.27 -- General purpose digital input/output pin. CAP0.1 -- Capture input for Timer 0, channel 1. P1.28 -- General purpose digital input/output pin. PCAP1.0 -- Capture input for PWM1, channel 0. MAT0.0 -- Match output for Timer 0, channel 0. P1.29 -- General purpose digital input/output pin. PCAP1.1 -- Capture input for PWM1, channel 1. MAT0.1 -- Match output for Timer 0, channel 0. P1.30 -- General purpose digital input/output pin. VBUS -- Indicates the presence of USB bus power. Note: This signal must be HIGH for USB reset to occur. AD0.4 -- ADC 0, input 4. P1.31 -- General purpose digital input/output pin. SCK1 -- Serial Clock for SSP1. AD0.5 -- ADC 0, input 5. Port 2: Port 2 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the Pin Connect block. Pins 14 through 31 of this port are not available.
P1.19/CAP1.1
P1.20/PWM1.2/ 34 SCK0
P1.21/PWM1.3/ 35 SSEL0
P1.22/MAT1.0
36
P1.23/PWM1.4/ 37 MISO0
P1.24/PWM1.5/ 38 MOSI0
P1.25/MAT1.1
39
P1.26/PWM1.6/ 40 CAP0.0
P1.27/CAP0.1 P1.28/ PCAP1.0/ MAT0.0 P1.29/ PCAP1.1/ MAT0.1 P1.30/VBUS/ AD0.4
43 44
P1.31/SCK1/ AD0.5
20
I/O I/O I I/O
P2.0 to P2.31
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
9 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol
Pin description ...continued Pin Type location 75 I/O O O O 74 I/O O O O 73 I/O O I O 70 I/O O I O 69 I/O O I O 68 I/O O O O 67 I/O I I O 66 I/O I O O 65 I/O O O O Description P2.0 -- General purpose digital input/output pin. PWM1.1 -- Pulse Width Modulator 1, channel 1 output. TXD1 -- Transmitter output for UART1. TRACECLK -- Trace Clock. P2.1 -- General purpose digital input/output pin. PWM1.2 -- Pulse Width Modulator 1, channel 2 output. RXD1 -- Receiver input for UART1. PIPESTAT0 -- Pipeline Status, bit 0. P2.2 -- General purpose digital input/output pin. PWM1.3 -- Pulse Width Modulator 1, channel 3 output. CTS1 -- Clear to Send input for UART1. PIPESTAT1 -- Pipeline Status, bit 1. P2.3 -- General purpose digital input/output pin. PWM1.4 -- Pulse Width Modulator 1, channel 4 output. DCD1 -- Data Carrier Detect input for UART1. PIPESTAT2 -- Pipeline Status, bit 2. P2.4 -- General purpose digital input/output pin. PWM1.5 -- Pulse Width Modulator 1, channel 5 output. DSR1 -- Data Set Ready input for UART1. TRACESYNC -- Trace Synchronization. P2.5 -- General purpose digital input/output pin. PWM1.6 -- Pulse Width Modulator 1, channel 6 output. DTR1 -- Data Terminal Ready output for UART1. TRACEPKT0 -- Trace Packet, bit 0. P2.6 -- General purpose digital input/output pin. PCAP1.0 -- Capture input for PWM1, channel 0. RI1 -- Ring Indicator input for UART1. TRACEPKT1 -- Trace Packet, bit 1. P2.7 -- General purpose digital input/output pin. RD2 -- CAN2 receiver input. RTS1 -- Request to Send output for UART1. TRACEPKT2 -- Trace Packet, bit 2. P2.8 -- General purpose digital input/output pin. TD2 -- CAN2 transmitter output. TXD2 -- Transmitter output for UART2. TRACEPKT3 -- Trace Packet, bit 3.
P2.0/PWM1.1/ TXD1/ TRACECLK
P2.1/PWM1.2/ RXD1/ PIPESTAT0
P2.2/PWM1.3/ CTS1/ PIPESTAT1
P2.3/PWM1.4/ DCD1/ PIPESTAT2
P2.4/PWM1.5/ DSR1/ TRACESYNC
P2.5/PWM1.6/ DTR1/ TRACEPKT0
P2.6/PCAP1.0/ RI1/ TRACEPKT1
P2.7/RD2/ RTS1/ TRACEPKT2
P2.8/TD2/ TXD2/ TRACEPKT3
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
10 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol
Pin description ...continued Pin Type location 64 I/O O I I 53 I/O Description P2.9 -- General purpose digital input/output pin. U1CONNECT -- Signal used to switch an external 1.5 k resistor under the software control. Used with the SoftConnect USB feature. RXD2 -- Receiver input for UART2. EXTIN0 -- External Trigger Input. P2.10 -- General purpose digital input/output pin. Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take over control of the part after a reset. I EINT0 -- External interrupt 0 input. P2.11 -- General purpose digital input/output pin. EINT1 -- External interrupt 1 input. MCIDAT1 -- Data line for SD/MMC interface. (LPC2368 only) I2STX_CLK -- Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. P2.12 -- General purpose digital input/output pin. EINT2 -- External interrupt 2 input. MCIDAT2 -- Data line for SD/MMC interface. (LPC2368 only) I2STX_WS -- Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. P2.13 -- General purpose digital input/output pin. EINT3 -- External interrupt 3 input. MCIDAT3 -- Data line for SD/MMC interface. (LPC2368 only) I2STX_SDA -- Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the Pin Connect block. Pins 0 through 24, and 27 through 31 of this port are not available. P3.25 -- General purpose digital input/output pin. MAT0.0 -- Match output for Timer 0, channel 0. PWM1.2 -- Pulse Width Modulator 1, output 2. P3.26 -- General purpose digital input/output pin. MAT0.1 -- Match output for Timer 0, channel 1. PWM1.3 -- Pulse Width Modulator 1, output 3. Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the Pin Connect block. Pins 0 through 27, 30, and 31 of this port are not available. P4.28 -- General purpose digital input/output pin. MAT2.0 -- Match output for Timer 2, channel 0. TXD3 -- Transmitter output for UART3. P4.29 -- General purpose digital input/output pin. MAT2.1 -- Match output for Timer 2, channel 1. RXD3 -- Receiver input for UART3. TDO -- Test Data out for JTAG interface.
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
P2.9/ U1CONNECT/ RXD2/ EXTIN0
P2.10/EINT0
P2.11/EINT1/ MCIDAT1/ I2STX_CLK
52
I/O I O I/O
P2.12/EINT2/ MCIDAT2/ I2STX_WS
51
I/O I O I/O
P2.13/EINT3/ MCIDAT3/ I2STX_SDA
50
I/O I O I/O
P3.0 to P3.31
I/O
P3.25/MAT0.0/ PWM1.2
27
I/O O O
P3.26/MAT0.1/ PWM1.3
26
I/O O O I/O
P4.0 to P4.31
P4.28/MAT2.0/ TXD3
82
I/O O O
P4.29/MAT2.1/ RXD3
85
I/O O I
TDO
LPC2364_66_68_1
1
O
Preliminary data sheet
Rev. 01 -- 22 September 2006
11 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 3. Symbol TDI TMS TRST TCK RTCK
Pin description ...continued Pin Type location 2 3 4 5 100 I I I I I/O Description TDI -- Test Data in for JTAG interface. TMS -- Test Mode Select for JTAG interface. TRST -- Test Reset for JTAG interface. TCK -- Test Clock for JTAG interface. RTCK -- JTAG interface control signal. Note: LOW on this pin while RESET is LOW enables ETM pins (P2.9:0) to operate as Trace port after reset.
RSTOUT RESET
14 17
O I
RSTOUT -- LOW on this pin indicates LPC2364/66/68 being in Reset state. External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier. Input to the RTC oscillator circuit. Output from the RTC oscillator circuit. Ground: 0 V reference
X1 X2 RTCX1 RTCX2 VSS
22 23 16 18 15, 31, 41, 55, 72, 97, 83 11 28, 54, 71, 96, 13, 42, 84 10
I O I O I
VSSA VDD(3V3) VDCDC(3V3) VDDA
I I I I
Analog Ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 3.3 V Power Supply: This is the power supply voltage for the I/O ports. 3.3 V DC-to-DC Power Supply: This is the power supply for the on-chip DC-to-DC converter only. If the DC-to-DC is not used, these pins must be unconnected. Analog 3.3 V Power Supply: This should be nominally the same voltage as VDD but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. ADC Reference: This should be nominally the same voltage as VDD but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC and DAC. RTC Power Supply: 3.3 V on this pin supplies the power to the RTC.
VREF
12
I
VBAT
19
I
7. Functional description
7.1 Architectural overview
The LPC2364/66/68 microcontroller consists of an ARM7TDMI-S CPU with emulation support, the ARM7 Local Bus for closely coupled, high speed access to the majority of on-chip memory, the AMBA Advanced High-performance Bus (AHB) interfacing to high speed on-chip peripherals, and the AMBA Advanced Peripheral Bus (APB) for connection to other on-chip peripheral functions. The microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte order.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
12 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
The LPC2364/66/68 implements two AHB buses in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, and General Purpose DMA Controller. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into off-chip memory or unused space in memory residing on AHB1. In summary, bus masters with access to AHB1 are the ARM7 itself, the General Purpose DMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block. AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the AHB address space. Lower speed peripheral functions are connected to the APB bus. The AHB to APB bridge interfaces the APB bus to the AHB bus. APB peripherals are also allocated a 2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is allocated a 16 kB address space within the APB address space. The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets:
* The standard 32-bit ARM set. * A 16-bit Thumb set.
The Thumb set's 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM's performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
13 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
7.2 On-chip flash programming memory
The LPC2364/66/68 incorporate a 128 kB, 256 kB, and 512 kB flash memory system respectively. This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port (UART0). The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field and firmware upgrades. The flash memory is 128 bits wide and includes pre-fetching and buffering techniques to allow it to operate at SRAM speeds of 72 MHz. The LPC2364/66/68 provides a minimum of 100000 write/erase cycles and 20 years of data retention.
7.3 On-chip SRAM
The LPC2364/66/68 includes a SRAM memory of 8 kB, 32 kB, and 32 kB respectively, reserved for the ARM processor exclusive use. This RAM may be used for code and/or data storage and may be accessed as 8 bits, 16 bits, and 32 bits. A 16 kB SRAM block serving as a buffer for the Ethernet controller and an 8 kB SRAM associated with the USB device can be used both for data and code storage, too. Remaining SRAM such as a 4 kB USB FIFO and a 2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered and retains the content in the absence of the main power supply.
7.4 Memory map
The LPC2364/66/68 memory map incorporates several distinct regions as shown in Figure 3. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either flash memory (default), Boot ROM, or SRAM (see Section 7.25.6).
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
14 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
4.0 GB AHB PERIPHERALS 3.75 GB APB PERIPHERALS 3.5 GB
0xFFFF FFFF 0xF000 0000
0xE000 0000
3.0 GB RESERVED ADDRESS SPACE
0xC000 0000
2.0 GB BOOT ROM AND BOOT FLASH (BOOT FLASH REMAPPED FROM ON-CHIP FLASH) RESERVED ADDRESS SPACE ETHERNET RAM (16 kB) USB RAM (8 KB)
0x8000 0000
0x7FE0 3FFF 0x7FE0 0000 0x7FD0 1FFF 0x7FD0 0000
RESERVED ADDRESS SPACE 0x4000 8000 0x4000 7FFF 32 kB LOCAL ON-CHIP STATIC RAM (LPC2366/LPC2368) 0x4000 2000 0x4000 1FFF 8 kB LOCAL ON-CHIP STATIC RAM (LPC2364) 1.0 GB 0x4000 0000
RESERVED FOR ON-CHIP MEMORY 0x0008 0000 0x0007 FFFF 0x0004 0000 0x0003 FFFF 0x0002 0000 0x0001 FFFF 0x0000 0000
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY (LPC2368) TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY (LPC2366) 0.0 GB TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY (LPC2364)
002aac577
Fig 3. LPC2364/66/68 memory map
7.5 Interrupt controller
The ARM processor core has two interrupt inputs called Interrupt Request (IRQ) and Fast Interrupt Request (FIQ). The Vectored Interrupt Controller (VIC) takes 32 interrupt request inputs and programmably assigns them as FIQ or vectored IRQ types. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
15 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a programmable interrupt priority. When more than one interrupt is assigned the same priority and occur simultaneously, the one connected to the lowest numbered VIC channel will be serviced first. The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping to the address supplied by that register.
7.5.1 Interrupt sources
Each peripheral device has one interrupt line connected to the Vectored Interrupt Controller but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on PORT0 and PORT2 (total of 42 pins) regardless of the selected function, can be programmed to generate an interrupt on a rising edge, a falling edge, or both. Such interrupt request coming from PORT0 and/or PORT2 will be combined with the EINT3 interrupt requests.
7.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined.
7.7 General purpose DMA controller
The General Purpose DMA Controller (GPDMA) is an AMBA AHB compliant peripheral allowing selected LPC2364/66/68 peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receive. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the AHB master.
7.7.1 Features
* Two DMA channels. Each channel can support a unidirectional transfer. * The GPDMA can transfer data between the 8 kB SRAM and peripherals such as the
SD/MMC, two SSP, and I2S interfaces.
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
16 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
* Single DMA and burst DMA request signals. Each peripheral connected to the
GPDMA can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the GPDMA.
* Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers.
* Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
* Hardware DMA channel priority. Each DMA channel has a specific hardware priority.
DMA channel 0 has the highest priority and channel 1 has the lowest priority. If requests from two channels become active at the same time the channel with the highest priority is serviced first.
* AHB slave DMA programming interface. The GPDMA is programmed by writing to the
DMA control registers over the AHB slave interface.
* One AHB bus master for transferring data. This interface transfers data when a DMA
request goes active.
* 32-bit AHB master bus width. * Incrementing or non-incrementing addressing for source and destination. * Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the peripheral.
* Internal four-word FIFO per channel. * Supports 8-bit, 16-bit, and 32-bit wide transactions. * An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
* Interrupt masking. The DMA error and DMA terminal count interrupt requests can be
masked.
* Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.8 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC2364/66/68 use accelerated GPIO functions:
* GPIO registers are relocated to the ARM local bus so that the fastest possible I/O
timing can be achieved.
* Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
* All GPIO registers are byte and half-word addressable. * Entire port value can be written in one instruction.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
17 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Additionally, any pin on PORT0 and PORT2 (total of 42 pins) providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake up the chip from Power-down mode.
7.8.1 Features
* Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
* Direction control of individual bits. * All I/O default to inputs after reset. * Backward compatibility with other earlier devices is maintained with legacy PORT0
and PORT1 registers appearing at the original addresses on the APB bus.
7.9 Ethernet
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with Scatter-Gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC2364/66/68 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access the USB SRAM if it is not being used by the USB block. The Ethernet block interfaces between an off-chip Ethernet PHY using the RMII (reduced MII) protocol and the on-chip MIIM (Media Independent Interface Management) serial bus.
7.9.1 Features
* Ethernet standards support:
- Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. - Fully compliant with IEEE standard 802.3. - Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure. - Flexible transmit and receive frame options. - VLAN frame support.
* Memory management:
- Independent transmit and receive buffers memory mapped to shared SRAM. - DMA managers with scatter/gather DMA and arrays of frame descriptors. - Memory traffic optimized by buffering and pre-fetching.
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
18 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
* Enhanced Ethernet features:
- Receive filtering. - Multicast and broadcast frame support for both transmit and receive. - Optional automatic FCS insertion (CRC) for transmit. - Selectable automatic transmit frame padding. - Over-length frame support for both transmit and receive allows any length frames. - Promiscuous receive mode. - Automatic collision back-off and frame retransmission. - Includes power management by clock switching. - Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter.
* Physical interface:
- Attachment of external PHY chip through standard Reduced MII (RMII) interface. - PHY register access is available via the Media Independent Interface Management (MIIM) interface.
7.10 USB interface
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and a number (127 maximum) of peripherals. The host controller allocates the USB bandwidth to attached devices through a token based protocol. The bus supports hot plugging, unplugging and dynamic configuration of the devices. All transactions are initiated by the host controller.
7.10.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of register interface, serial interface engine, endpoint buffer memory, and the DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. The DMA controller when enabled transfers data between the endpoint buffer and the USB RAM.
7.10.2 Features
* * * * *
Fully compliant with USB 2.0 specification (full speed). Supports 32 physical (16 logical) endpoints with a 4 kB USB buffer. Supports Control, Bulk, Interrupt and Isochronous endpoints. Scalable realization of endpoints at run time. Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time.
* Supports SoftConnect and GoodLink features. * While USB is in the Suspend mode, LPC2364/66/68 can enter one of the reduced
power down modes and wake up on a USB activity.
* Supports DMA transfers with the DMA RAM of 8 kB on all non-control endpoints.
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
19 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
* Allows dynamic switching between CPU-controlled and DMA modes. * Double buffer implementation for Bulk and Isochronous endpoints. 7.11 CAN controller and acceptance filters
The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router among a number of CAN buses in industrial or automotive applications. Each CAN controller has a register structure similar to the Philips SJA1000 and the PeliCAN Library block, but the 8-bit registers of those devices have been combined in 32-bit words to allow simultaneous access in the ARM environment. The main operational difference is that the recognition of received Identifiers, known in CAN terminology as Acceptance Filtering, has been removed from the CAN controllers and centralized in a global Acceptance Filter.
7.11.1 Features
* * * * * *
Two CAN controllers and buses. Data rates to 1 Mbit/s on each bus. 32-bit register and RAM access. Compatible with CAN specification 2.0B, ISO 11898-1. Global Acceptance Filter recognizes 11-bit and 29-bit Rx Identifiers for all CAN buses. Acceptance Filter can provide FullCAN-style automatic reception for selected Standard Identifiers.
* Full CAN messages can generate interrupts. 7.12 10-bit ADC
The LPC2364/66/68 contain one ADC. It is a single 10-bit successive approximation ADC with six channels.
7.12.1 Features
* * * * * * * *
10-bit successive approximation ADC. Input multiplexing among 6 pins. Power-down mode. Measurement range 0 V to Vi(VREF). 10-bit conversion time 2.44 s. Burst conversion mode for single or multiple inputs. Optional conversion on transition of input pin or Timer Match signal. Individual result registers for each ADC channel to reduce interrupt overhead.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
20 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
7.13 10-bit DAC
The DAC allows the LPC2364/66/68 to generate a variable analog output. The maximum output value of the DAC is Vi(VREF).
7.13.1 Features
* * * * *
10-bit DAC Resistor string architecture Buffered output Power-down mode Selectable output drive
7.14 UARTs
The LPC2364/66/68 each contain four UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 can be achieved with any crystal frequency above 2 MHz.
7.14.1 Features
* * * *
16 B Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. mechanism that enables software flow control implementation.
* Fractional divider for baud rate control, autobaud capabilities and FIFO control * UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS)
* UART3 includes an IrDA mode to support infrared communication. 7.15 SPI serial I/O controller
The LPC2364/66/68 each contain one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave always sends 8 bits to 16 bits of data to the master.
7.15.1 Features
* * * * *
LPC2364_66_68_1
Compliant with Serial Peripheral Interface (SPI) specification Synchronous, Serial, Full Duplex Communication Combined SPI master and slave Maximum data bit rate of one eighth of the input clock rate 8 bits to 16 bits per transfer
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
21 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
7.16 SSP serial I/O controller
The LPC2364/66/68 each contain two SSP controllers. The SSP is a Synchronous Serial Port (SSP) controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data.
7.16.1 Features
* Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire
buses
* * * * *
Synchronous Serial Communication Master or slave operation 8-frame FIFOs for both transmit and receive Four bits to 16 bits frame DMA transfers supported by GPDMA
7.17 SD/MMC card interface (available in LPC2368 only)
The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD memory cards. The SD card interface conforms to the SD Multimedia Card Specification Version 2.11.
7.17.1 Features
* The MCI interface provides all functions specific to the Secure Digital/MultiMedia
memory card. These include the clock generation unit, power management control, and command and data transfer.
* Conformance to Multimedia Card Specification v2.11. * Conformance to Secure Digital Memory Card Physical Layer Specification, v0.96. * Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital memory card.
* DMA supported through the General Purpose DMA Controller. 7.18 I2C-bus serial I/O controllers
The LPC2364/66/68 each contains three I2C-bus controllers. The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be controlled by more than one bus master connected to it.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
22 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
The I2C-bus implemented in LPC2364/66/68 supports bit rates up to 400 kbit/s (Fast I2C-bus).
7.18.1 Features
* I2C0 is a standard I2C compliant bus interface with open-drain pins. * I2C1 and I2C2 use standard I/O pins and do not support powering off of individual
devices connected to the same bus lines
* * * * *
Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. one serial bus.
* Serial clock synchronization allows devices with different bit rates to communicate via * Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
* The I2C-bus can be used for test and diagnostic purposes. 7.19 I2S-bus serial I/O controllers
The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC2364/66/68 provides a separate transmit and receive channel, each of which can operate as either a master or a slave.
7.19.1 Features
* The interface has separate input output channels each of which can operate in master
or slave mode.
* Capable of handling 8-bit, 16-bit, and 32-bit word sizes. * Mono and stereo audio data supported. * The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
* * * *
Configurable Word Select period in master mode (separately for I2S input and output). Two 8 word FIFO data buffers are provided, one for transmit and one for receive. Generates interrupt requests when buffer levels cross a programmable boundary. Two DMA requests, controlled by programmable buffer levels. These are connected to the General Purpose DMA block.
* Controls include reset, stop and mute options separately for I2S input and I2S output.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
23 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
7.20 General purpose 32-bit timers/external event counters
The LPC2364/66/68 include four 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. The Timer/Counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt.
7.20.1 Features
* A 32-bit Timer/Counter with a programmable 32-bit Prescaler. * Counter or Timer operation * Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
* Four 32-bit match registers that allow:
- Continuous operation with optional interrupt generation on match. - Stop timer on match with optional interrupt generation. - Reset timer on match with optional interrupt generation.
* Up to four external outputs corresponding to match registers, with the following
capabilities: - Set low on match. - Set high on match. - Toggle on match. - Do nothing on match.
7.21 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2364/66/68. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features, and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the PWMMR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs.
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
24 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge).
7.21.1 Features
* LPC2364/66/68 has one PWM block with Counter or Timer operation (may use the
peripheral clock or one of the capture inputs as the clock source).
* Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow: - Continuous operation with optional interrupt generation on match. - Stop timer on match with optional interrupt generation. - Reset timer on match with optional interrupt generation.
* Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the output is a constant low. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses.
* Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate.
* Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
* Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must `release' new match values before they can become effective.
* May be used as a standard timer if the PWM mode is not enabled. * A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 7.22 Watchdog timer
The purpose of the Watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the Watchdog will generate a system reset if the user program fails to `feed' (or reload) the Watchdog within a predetermined amount of time.
7.22.1 Features
* Internally resets chip if not periodically reloaded. * Debug mode. * Enabled by software but requires a hardware reset or a Watchdog reset/interrupt to be
disabled.
* Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. * Flag to indicate Watchdog reset. * Programmable 32-bit timer with internal pre-scaler.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
25 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
* Selectable time period from (Tcy(WDCLK) x 256 x 4) to (Tcy(WDCLK) x 232 x 4) in
multiples of Tcy(WDCLK) x 4.
* The Watchdog clock (WDCLK) source can be selected from the RTC clock, the
Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of potential timing choices of Watchdog operation under different power reduction conditions. It also provides the ability to run the Watchdog timer from an entirely internal source that is not dependent on an external crystal and its associated components and wiring, for increased reliability.
7.23 Real time clock and battery RAM
The Real Time Clock (RTC) is a set of counters for measuring time when system power is on, and optionally when it is off. It uses little power in Power-down mode. On the LPC2364/66/68, the RTC can be clocked by a separate 32.768 KHz oscillator, or by a programmable prescale divider based on the APB clock. Also, the RTC is powered by its own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V supply used by the rest of the device. The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery.
7.23.1 Features
* Measures the passage of time to maintain a calendar and clock. * Ultra Low Power design to support battery powered systems. * Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
* Dedicated 32 kHz oscillator or programmable prescaler from APB clock. * Dedicated power supply pin can be connected to a battery or to the main 3.3 V. * Periodic interrupts can be generated from increments of any field of the time registers,
and selected fractional second values.
* 2 kB data SRAM powered by VBAT. * RTC and Battery RAM power supply is isolated from the rest of the chip. 7.24 Clocking and power control
7.24.1 Crystal oscillators
The LPC2364/66/68 includes three independent oscillators. These are the Main Oscillator, the Internal RC oscillator, and the RTC oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Any of the three clock sources can be chosen by software to drive the PLL and ultimately the CPU. Following reset, the LPC2364/66/68 will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
26 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
7.24.1.1
Internal RC oscillator The Internal RC oscillator (IRC) may be used as the clock source for the watchdog timer, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is trimmed to 1 % accuracy. Upon power-up or any chip reset, the LPC2364/66/68 uses the IRC as the clock source. Software may later switch to one of the other available clock sources.
7.24.1.2
Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator operates at frequencies of 1 MHz to 24 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL. The oscillator output is called OSCCLK. The clock selected as the PLL input is PLLCLKIN, and the ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of PLLCLKIN and CCLK are the same value unless the PLL is active and connected. Refer to Section 7.24.2 for additional information.
7.24.1.3
RTC oscillator The RTC oscillator can be used as the clock source for the RTC and/or the watchdog timer. Also, the RTC oscillator can be used to drive the PLL and the CPU.
7.24.2 PLL
The PLL accepts an input clock frequency in the range of 31 kHz to 50 MHz. The input frequency is multiplied up to a high frequency, then divided down to provide the actual clock used by the CPU and the USB block. The PLL input, in the range of 32 kHZ to 50 MHz, may initially be divided down by a value `N', which may be in the range of 1 to 256. This input division provides a wide range of output frequencies from the same input frequency. Following the PLL input divider is the PLL multiplier. This can multiply the input divider output through the use of a Current Controlled Oscillator (CCO) by a value `M', in the range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to 550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a phase-frequency detector to compare the divided CCO output to the multiplier input. The error value is used to adjust the CCO frequency. The PLL is turned off and bypassed following a chip Reset and by entering Power-down mode. PLL is enabled by software only. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source.
7.24.3 Wake-up timer
The LPC2364/66/68 begins operation at power-up and when awakened from Power-down mode or Deep power-down mode by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of Reset, and
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
27 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up Timer. The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions.
7.24.4 Power control
The LPC2364/66/68 supports a variety of power control features. There are four special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, re-configuring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, Peripheral Power Control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. The LPC2364/66/68 also implements a separate power domain in order to allow turning off power to the bulk of the device while maintaining operation of the Real Time Clock and a small SRAM, referred to as the Battery RAM. 7.24.4.1 Idle mode In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 7.24.4.2 Sleep mode In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The 32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The CCLK and USB clock dividers automatically get reset to zero. The Sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Sleep mode reduces chip power consumption to a very low value. The Flash memory is left on in Sleep mode, allowing a very quick wake-up.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
28 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
On the wake-up of sleep mode, if the IRC was used before entering sleep mode, the code execution and peripherals activities will resume after 4 cycles expire. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. The customers need to reconfigure the PLL and clock dividers accordingly. 7.24.4.3 Power-down mode Power-down mode does everything that Sleep mode does, but also turns off the IRC oscillator and the Flash memory. This saves more power, but requires waiting for resumption of Flash operation before execution of code or data access in the Flash memory can be accomplished. On the wake-up of power-down mode, if the IRC was used before entering power-down mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. In the meantime, the flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 s Flash start-up time. When it times out, access to the Flash will be allowed. The customers need to reconfigure the PLL and clock dividers accordingly. 7.24.4.4 Deep power-down mode Deep power-down mode is like Power-down mode, but the on-chip regulator that supplies power to internal logic is also shut off. This produces the lowest possible power consumption without actually removing power from the entire chip. Since Deep power-down mode shuts down the on-chip logic power supply, there is no register or memory retention, and resumption of operation involves the same activities as a full-chip reset. If power is supplied to the LPC2364/66/68 during Deep power-down mode, wake-up can be caused by external Reset. While in Deep power-down mode, external device power may be removed. In this case, the LPC2364/66/68 will start up when external power is restored. Essential data may be retained through Deep power-down mode (or through complete powering off of the chip) by storing data in the Battery RAM, as long as the external power to the VBAT pin is maintained. 7.24.4.5 Power domains The LPC2364/66/68 provides two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the Real Time Clock and the Battery RAM. The 3.3V (VDD(3V3)) pins power both the on-chip DC-DC converter and the I/O pads. These pins provide the power for the CPU and most of the peripherals. If power is removed from the VDD pins, the CPU and related peripherals stop. The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions require a minimum of power to operate, which can be supplied by an external battery.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
29 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
7.25 System control
7.25.1 Reset
Reset has four sources on the LPC2364/66/68: the RESET pin, the Watchdog Reset, Power On Reset (POR) and the Brown Out Detection circuit (BOD). The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, starts the Wake-up timer (see description in Section 7.24.3 "Wake-up timer"), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the Flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the Boot Block. At that point, all of the processor and peripheral registers have been initialized to predetermined values.
7.25.2 Brown-out detection
The LPC2364/66/68 includes 2-stage monitoring of the voltage on the VDD pins. If this voltage falls below 2.95 V, the Brown-Out Detector (BOD) asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the VIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts Reset to inactivate the LPC2364/66/68 when the voltage on the VDD pins falls below 2.65 V. This Reset prevents alteration of the Flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the Power-On Reset circuitry maintains the overall Reset. Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly-executed event loop to sense the condition.
7.25.3 Code security
This feature of the LPC2364/66/68 allows an application to control whether it can be debugged or protected from observation. If after reset the on-chip bootloader detects a valid checksum in flash and reads 0x8765 4321 from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be protected from observation. Once debugging is disabled, it can be enabled by performing a full chip erase using the ISP.
7.25.4 AHB bus
The LPC2364/66/68 implements two AHB buses in order to allow the Ethernet block to operate without interference caused by other system activity. The primary AHB, referred to as AHB1, includes the Vectored Interrupt Controller, General Purpose DMA Controller, USB interface, and a 8 kB SRAM primarily intended for use by the USB. The second AHB, referred to as AHB2, includes only the Ethernet block and an associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into unused space in memory residing on AHB1.
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
30 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the General Purpose DMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2 are the ARM7 and the Ethernet block.
7.25.5 External interrupt inputs
The LPC2364/66/68 include up to 46 edge sensitive interrupt inputs combined with up to to four level sensitive external interrupt inputs as selectable pin functions. The external interrupt inputs can optionally be used to wake up the processor from Power-down mode.
7.25.6 Memory mapping control
The memory mapping control alters the mapping of the interrupt vectors that appear at the beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot ROM or the SRAM. This allows code running in different memory spaces to have control of the interrupts.
7.26 Emulation and debugging
The LPC2364/66/68 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on P2.0 to P2.9. This means that all communication, timer, and interface peripherals residing on other pins are available during the development and debugging phase as they are when the application is run in the embedded system itself.
7.26.1 EmbeddedICE
The EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present on the target system. The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic.
7.26.2 Embedded trace
Since the LPC2364/66/68 have significant amounts of on-chip memories, it is not possible to determine how the processor core is operating simply by observing the external pins. The ETM provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to a trace port. A software debugger allows configuration of the ETM using a JTAG interface and displays the trace information that has been captured. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external Trace Port Analyzer captures the trace information under software debugger control. The trace port can broadcast the Instruction trace information. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
31 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction.
7.26.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC, which is present in the EmbeddedICE logic. The LPC2364/66/68 contain a specific configuration of RealMonitor software programmed into the on-chip ROM memory.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
32 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol VDD VDDA Vi(VBAT) Vi(VREF) VIA VI Parameter supply voltage (core and external rail) analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF analog input voltage input voltage on ADC related pins 5 V tolerant I/O pins; only valid when the VDD supply voltage is present other I/O pins IDD ISS Tstg Ptot(pack) supply current ground current storage temperature total power dissipation (per package) based on package heat transfer, not device power consumption human body model all pins
[1] The following applies to the Limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] [3] [4] [5] [6] Including voltage on outputs in 3-state mode. Not to exceed 4.6 V. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[6] [2]
Conditions
Min -0.5 -0.5
Max +3.6 +4.6 +4.6 +4.6 +5.1 +6.0
Unit V V V V V V
for the RTC
-0.5 -0.5 -0.5 -0.5
[2][3] [4] [4] [5]
-0.5 -40 -
VDD + 0.5 100 100 +125 1.5
V mA mA C W
per supply pin per ground pin
Vesd
electrostatic discharge voltage
2
V
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
33 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
9. Static characteristics
Table 5. Static characteristics Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol VDD(3V3) VDDA Vi(VBAT) Vi(VREF) Parameter supply voltage analog 3.3 V pad supply voltage input voltage on pin VBAT input voltage on pin VREF LOW-level input current VI = 0 V; no pull-up HIGH-level input current OFF-state output current I/O latch-up current input voltage output voltage HIGH-level input voltage LOW-level input voltage hysteresis voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current IOH = -4 mA IOL = -4 mA VOH = VDD - 0.4 V VOL = 0.4 V
[6] [2]
Conditions core and external rail
Min 3.0 3.0 2.0 2.5
Typ[1] 3.3 3.3 3.3 3.3
Max 3.6 3.6 3.6 VDDA
Unit V V V V
Standard port pins, RESET, RTCK IIL IIH IOZ Ilatch VI VO VIH VIL Vhys VOH VOL IOH IOL IOHS IOLS Ipd Ipu [3][4][5]
0.4 50 -50 0
3 3 3 100 5.5 VDD 0.8 0.4 -45 50 150 -85 0
A A A mA V V V V V V V mA mA mA mA A A A
VI = VDD; no pull-down VO = 0 V; VO = VDD; no pull-up/down -(0.5VDD) < VI < (1.5VDD) Tj < 125 C pin configured to provide a digital function output active
0 0 2.0 VDD - 0.4 -4 4 10 -15 0
[6]
[6]
[6]
HIGH-level short-circuit VOH = 0 V output current LOW-level short-circuit output current pull-down current pull-up current VOL = VDDA VI = 5 V VI = 0 V VDD < VI < 5 V
[7]
[7]
[8]
[8]
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
34 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 5. Static characteristics ...continued Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol
act)
Parameter
Conditions VDCDC(3V3) = 3.3 V; Tamb = 25 C; code
Min -
Typ[1]
Max
Unit
IDCDC(3V3)( Core active mode supply current
while(1){}
executed from flash, no peripherals enabled, PCLK = CCLK CCLK = 10 MHz CCLK = 72 MHz all peripherals enabled, PCLK = CCLK/8 CCLK = 10 MHz CCLK = 72 MHz all peripherals enabled, PCLK = CCLK CCLK = 10 MHz CCLK = 72 MHz
pd)
15 21 27 125 150 15 20 28 0.7VDD(3V3) 2 10 92 63
mA mA
mA mA
mA mA A A A A V
IDCDC(3V3)( Core Power-down mode supply current
VDCDC(3V3) = 3.3 V, Tamb = +25 C
IDCDC(3V3)( Core Deep Power-down VDCDC(3V3) = 3.3 V, mode supply current Tamb = +25 C dpd) IBATact active mode battery supply current DC-DC on DC-DC off
I2C-bus pins (P0.27 and P0.28) VIH VIL Vhys VOL ILI HIGH-level input voltage LOW-level input voltage hysteresis voltage LOW-level output voltage input leakage current IOLS = 3 mA VI = VDD VI = 5 V Oscillator pins Vi(XTAL1) Vo(XTAL2) Vi(RTXC1) Vo(RTXC2) USB pins IOZ VBUS
LPC2364_66_68_1
0.3VDD(3V3) V V V A A V V V V 0.4 4 22 1.8 1.8 1.8 1.8
0.5VDD(3V3) -
[6]
0 0 0 0
[11]
input voltage on pin XTAL1 output voltage on pin XTAL2 input voltage on pin RTXC1 output voltage on pin RTXC2 OFF-state output current bus supply voltage 0 V < VI < 3.3 V
-
-
10 5.25
A V
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
35 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 5. Static characteristics ...continued Tamb = -40 C to +85 C for commercial applications, unless otherwise specified. Symbol VDI VCM Vth(rs)se Parameter differential input sensitivity differential common mode voltage range single-ended receiver switching threshold voltage LOW-level output voltage for low-/full-speed HIGH-level output voltage (driven) for low-/full-speed RL of 1.5 k to 3.6 V Conditions |(D+) - (D-)| includes VDI range Min 0.2 0.8 0.8 Typ[1] Max 2.5 2.0 Unit V V V
VOL
-
-
0.18
V
VOH
RL of 15 k to GND
2.8
-
3.5
V
Ctrans ZDRV
transceiver capacitance pin to GND driver output steady state drive impedance for driver which is not high-speed capable (with 33 series resistor) pull-up resistance SoftConnect = ON
[12]
36
-
20 44.1
pF
Rpu
[1] [2] [3] [4] [5] [6] [7] [8] [9]
1.1
-
1.9
k
Typical ratings are not guaranteed. The values listed are at room temperature (+25 C), nominal supply voltages. The RTC typically fails when Vi(VBAT) drops below 1.6 V. Including voltage on outputs in 3-state mode. VDD supply voltages must be present. 3-state outputs go into 3-state mode when VDD is grounded. Accounts for 100 mV voltage drop in all supply lines. Only allowed for a short time period. Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. On pin VBAT.
[10] Optimized for low battery consumption. [11] To VSS. [12] Includes external resistors of 18 1 % on D+ and D-.
Table 6. ADC static characteristics VDDA = 2.5 V to 3.6 V; Tamb = -40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz. Symbol VIA Cia ED EL(adj) EO Parameter analog input voltage analog input capacitance differential linearity error integral non-linearity offset error
[1][2][3] [1][4] [1][5]
Conditions
Min 0 -
Typ -
Max VDDA 1 1 2 3
Unit V pF LSB LSB LSB
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
36 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
Table 6. ADC static characteristics ...continued VDDA = 2.5 V to 3.6 V; Tamb = -40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz. Symbol EG ET Rvsi
[1] [2] [3] [4] [5] [6] [7] [8]
Parameter gain error absolute error voltage source interface resistance
Conditions
[1][6] [1][7] [8]
Min -
Typ -
Max 0.5 4 40
Unit % LSB k
Conditions: VSSA = 0 V, VDDA = 3.3 V. The ADC is monotonic, there are no missing codes. The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 4. The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 4. The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 4. The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 4. The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 4. See Figure 5.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
37 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
offset error EO 1023
gain error EG
1022
1021
1020
1019
1018
(2)
7 code out 6
(1)
5
(5)
4
(4)
3
(3)
2
1
1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024
0 1 offset error EO 2 3 4 5 6 7 VIA (LSBideal)
1 LSB =
VDDA - VSSA 1024
002aac046
(1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve.
Fig 4. ADC characteristics
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
38 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
LPC2364/66/68
20 k
ADx.ySAMPLE
3 pF 5 pF
ADx.y
Rvsi
VEXT
VSS
002aac575
Fig 5. Suggested ADC interface - LPC2364/66/68 AD0.y pin
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
39 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
10. Dynamic characteristics
Table 7. Dynamic characteristics of USB pins (full-speed) CL = 50 pF; Rpu = 1.5 k on D+ to VDD, unless otherwise specified. Symbol tr tf tFRFM VCRS tFEOPT tFDEOP tJR1 tJR2 tEOPR1 Parameter rise time fall time differential rise and fall time matching output signal crossover voltage source SE0 interval of EOP source jitter for differential transition to SE0 transition receiver jitter to next transition receiver jitter for paired transitions EOP width at receiver 10 % to 90 % must reject as EOP; see Figure 7 must accept as EOP; see Figure 7
[1]
Conditions 10 % to 90 % 10 % to 90 % (tr/tf)
Min 8.5 7.7 1.3
Typ -
Max 13.8 13.7 109 2.0 175 +5 +18.5 +9 -
Unit ns ns % V ns ns ns ns ns
see Figure 7 see Figure 7
160 -2 -18.5 -9 40
tEOPR2
EOP width at receiver
[1]
82
-
-
ns
[1]
Characterized but not implemented as production test. Guaranteed by design.
Table 8. Dynamic characteristics Tamb = -40 C to +85 C for commercial applications; VDD over specified ranges.[1] Symbol External clock fosc Tcy(clk) tCHCX tCLCX tCLCH tCHCL I2C-bus tf(o)
[1] [2] [3]
Parameter oscillator frequency clock cycle time clock HIGH time clock LOW time clock rise time clock fall time pins (P0.27 and P0.28) output fall time
Conditions
Min 10 40 Tcy(clk) x 0.4 Tcy(clk) x 0.4 -
Typ[2] -
Max 25 100 5 5 -
Unit MHz ns ns ns ns ns ns
VIH to VIL
20 + 0.1 x Cb[3]
Parameters are valid over operating temperature range unless otherwise specified. Typical ratings are not guaranteed. The values listed are at room temperature (+25 C), nominal supply voltages. Bus capacitance Cb in pF, from 10 pF to 400 pF.
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
40 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
10.1 Timing
VDD - 0.5 V 0.45 V
0.2VDD + 0.9 V 0.2VDD - 0.1 V tCHCL tCLCX Tcy(clk)
002aaa907
tCHCX tCLCH
Fig 6. External clock timing
tPERIOD crossover point differential data lines
crossover point extended
source EOP width: tFEOPT differential data to SEO/EOP skew n * tPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 7. Differential data-to-EOP transition skew and EOP width
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
41 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
11. Application information
11.1 Suggested USB interface solutions
VDD
UP_LED CONNECT
LPC23XX
soft-connect switch
R1 1.5 k
VBUS D+ DVSS
002aac578
RS = 33 RS = 33
USB-B connector
Fig 8. LPC2364/66/68 USB interface on a self-powered device
VDD
R2
LPC23XX
UP_LED VBUS D+ DVSS
RS = 33 RS = 33
R1 1.5 k
USB-B connector
002aac579
Fig 9. LPC2364/66/68 USB interface on a bus-powered device
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
42 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
12. Package outline
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
c
y X 75 76 51 50 ZE A
e E HE wM bp pin 1 index 100 1 ZD bp D HD wM B vM B 25 vM A 26 detail X L Lp A A2 (A 3)
A1
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT407-1 REFERENCES IEC 136E20 JEDEC MS-026 JEITA EUROPEAN PROJECTION A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 14.1 13.9 E (1) 14.1 13.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 7o o 0
16.25 16.25 15.75 15.75
ISSUE DATE 00-02-01 03-02-20
Fig 10. Package outline SOT407-1 (LQFP100)
LPC2364_66_68_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
43 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
13. Abbreviations
Table 9. Acronym ADC AHB AMBA APB BOD CPU DAC DCC DMA ETM FIFO GPIO JTAG PHY PLL POR PWM RAM SPI SRAM SSP UART USB Abbreviations Description Analog-to-Digital Converter Advanced High-performance Bus Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Brown-Out Detection Central Processing Unit Digital-to-Analog Converter Debug Communications Channel Direct Memory Access Embedded Trace Macrocell First In, First Out General Purpose Input/Output Joint Test Action Group Physical Layer Phase-Locked Loop Power-On Reset Pulse Width Modulator Random Access Memory Serial Peripheral Interface Static Random Access Memory Synchronous Serial Port Universal Asynchronous Receiver/Transmitter Universal Serial Bus
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
44 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
14. Revision history
Table 10. Revision history Release date 20060922 Data sheet status Preliminary data sheet Change notice Supersedes Document ID LPC2364_66_68_1
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
45 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
15.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
15.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus -- logo is a trademark of Koninklijke Philips Electronics N.V.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
46 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
17. Contents
General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . 12 Architectural overview . . . . . . . . . . . . . . . . . . 12 On-chip flash programming memory . . . . . . . 14 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 14 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 15 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 16 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 16 General purpose DMA controller . . . . . . . . . . 16 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Fast general purpose parallel I/O . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 19 USB device controller . . . . . . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 CAN controller and acceptance filters . . . . . . 20 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 21 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SSP serial I/O controller . . . . . . . . . . . . . . . . . 22 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SD/MMC card interface (available in LPC2368 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.18 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 22 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.19 I2S-bus serial I/O controllers. . . . . . . . . . . . . . 23 7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.20 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.5.1 7.6 7.7 7.7.1 7.8 7.8.1 7.9 7.9.1 7.10 7.10.1 7.10.2 7.11 7.11.1 7.12 7.12.1 7.13 7.13.1 7.14 7.14.1 7.15 7.15.1 7.16 7.16.1 7.17 7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.21 Pulse width modulator . . . . . . . . . . . . . . . . . . 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.22 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.23 Real time clock and battery RAM. . . . . . . . . . 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24 Clocking and power control . . . . . . . . . . . . . . 7.24.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 7.24.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 7.24.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7.24.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 7.24.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7.24.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 7.24.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 7.24.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 7.25 System control . . . . . . . . . . . . . . . . . . . . . . . . 7.25.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.2 Brown-out detection . . . . . . . . . . . . . . . . . . . . 7.25.3 Code security . . . . . . . . . . . . . . . . . . . . . . . . 7.25.4 AHB bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.25.5 External interrupt inputs . . . . . . . . . . . . . . . . . 7.25.6 Memory mapping control . . . . . . . . . . . . . . . . 7.26 Emulation and debugging . . . . . . . . . . . . . . . 7.26.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 7.26.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 7.26.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics. . . . . . . . . . . . . . . . . 10.1 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Application information . . . . . . . . . . . . . . . . . 11.1 Suggested USB interface solutions . . . . . . . . 12 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information . . . . . . . . . . . . . . . . . . . . . . 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 15.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information . . . . . . . . . . . . . . . . . . . . 24 24 25 25 25 26 26 26 26 27 27 27 27 27 28 28 28 29 29 29 30 30 30 30 30 31 31 31 31 31 32 33 34 40 41 42 42 43 44 45 46 46 46 46 46 46
continued >>
LPC2364_66_68_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 -- 22 September 2006
47 of 48
Philips Semiconductors
LPC2364/2366/2368
Fast communication chip
17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 22 September 2006 Document identifier: LPC2364_66_68_1

▲Up To Search▲

Price & Availability of LPC2364FB100

	To Download LPC2364FB100 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .